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Winbond W25Q80DVSSIG
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Compliance
RoHS
Compliant
Dimensions
Height
2.16 mm
Physical
Case/Package
SOIC
Technical
Access Time
6 ns
Ambient Temperature Range High
85 °C
Frequency
80 MHz
Interface
SPI
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
1 MB
Memory Type
FLASH, NOR
Min Operating Temperature
-40 °C
Min Supply Voltage
2.7 V