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Winbond W25Q80BVSSIG
产品详情
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Compliance
Radiation Hardening
No
RoHS
Compliant
Dimensions
Height
2.16 mm
Physical
Case/Package
SOIC
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
8
Technical
Access Time
8.5 ns
Address Bus Width
1 b
Ambient Temperature Range High
85 °C
Density
8 Mb
Frequency
104 MHz
Interface
SPI
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
1 MB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.5 V
Nominal Supply Current
18 mA
Operating Supply Voltage
3.3 V
Page Size
256 B
Sync/Async
Asynchronous
Word Size
8 b