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Winbond W25Q64FVZPIG
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Compliance
Radiation Hardening
No
RoHS
Compliant
Dimensions
Height
800 µm
Physical
Case/Package
SOIC
Mount
Surface Mount
Number of Pins
8
Technical
Access Time
7 ns
Address Bus Width
1 b
Ambient Temperature Range High
85 °C
Density
64 Mb
Frequency
104 MHz
Interface
SPI
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
8 MB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.7 V
Nominal Supply Current
40 mA
Operating Supply Voltage
3 V
Page Size
256 B
Sync/Async
Synchronous
Word Size
8 b