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Winbond W25Q128FVFIG
产品详情
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Dimensions
Height
2.64 mm
Physical
Case/Package
SOIC
Mount
Surface Mount
Number of Pins
16
Technical
Access Time
7 ns
Address Bus Width
24 b
Ambient Temperature Range High
85 °C
Density
128 Mb
Frequency
104 MHz
Interface
SPI
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
16 MB
Memory Type
FLASH, NOR
Min Operating Temperature
-40 °C
Min Supply Voltage
2.7 V
Nominal Supply Current
20 mA
Number of Words
1.6777216e+07
Sync/Async
Synchronous
Word Size
8 b