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TE Connectivity / AMP 1-1658012-1

Conn Board to Board RCP 28 POS 0.8mm Solder ST SMD Tray

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Compliance

ELV
Compliant
RoHS
Compliant

Dimensions

Contact Finish Thickness - Mating
249.9995 nm
Height
3.05 mm
Pitch
800 µm
Row Spacing
3.463823 mm
Stack Height
25 mm

Physical

Contact Material
Bronze
Contact Plating
Gold
Housing Color
Black
Housing Material
Polymer
Mount
Surface Mount

Supply Chain

Lifecycle Status
Production

Technical

Connector Type
Connector, Receptacle, Socket
Contact Current Rating
1.25 A
Contact Style
Socket
Gender
Female
Impedance
50 Ω
Insulation Resistance
5 GΩ
Mating Alignment
Without
Max Operating Temperature
257 °C
Min Operating Temperature
-85 °C
Number of Contacts
28
Number of Positions
28
Number of Rows
2
Operating Supply Voltage
125 V
Orientation
Vertical
PCB Mount Alignment
With
PCB Mount Retention
With
PCB Mounting Orientation
Vertical
Plating Thickness
250 nm
Sealable
No
Stackable
No
Termination
SMD/SMT

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