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Taiwan Semiconductor BZV55C3V3 L1
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Compliance
Radiation Hardening
No
RoHS
Compliant
Dimensions
Diameter
1.6 mm
Length
85 Ω
Physical
Case/Package
MELF
Mount
-65 °C
Number of Pins
2
Supply Chain
Lifecycle Status
Production
Technical
Element Configuration
Single
Impedance
85 Ω
Max Operating Temperature
175 °C
Max Power Dissipation
175 °C
Max Reverse Leakage Current
2 µA
Min Operating Temperature
2 µA
Packaging
Tape and Reel
Power Dissipation
500 mW
Test Current
Y
Voltage Tolerance
5 %
Zener Voltage
3.3 V