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NXP Semiconductors MCIMX6L3EVN10AB
产品详情
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Compliance
Halogen Free
Halogen Free
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
TFBGA
Contact Plating
Copper, Silver, Tin
Mount
-40 °C
Number of Pins
432
Weight
587.912411 mg
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
1 GHz
Interface
CAN, I2C, I2S, UART, USB
Max Frequency
1 GHz
Max Operating Temperature
105 °C
Memory Type
105 °C
Min Operating Temperature
-40 °C
Number of Cores
1
Number of Timers/Counters
2