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NXP Semiconductors MCIMX6L3DVN10AB
产品详情
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Compliance
Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
TFBGA
Contact Plating
Copper, Silver, Tin
Mount
0 °C
Number of Pins
432
Weight
587.912411 mg
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
1 GHz
Max Frequency
1 GHz
Max I/O Voltage
3.6 V
Max Operating Temperature
95 °C
Memory Type
95 °C
Min Operating Temperature
0 °C
Number of Cores
1
RAM Size
256 kB