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NXP Semiconductors MCHC908GR8CFAE
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.4 mm
Length
7 mm
Width
7 mm
Physical
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
32
Technical
Core Architecture
HC08
Data Bus Width
8 b
Density
64 kb
Frequency
8 MHz
Interface
I2C, SCI, SPI
Max Frequency
8.2 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
85 °C
Memory Size
8 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
6
Number of Bits
8
Number of I/Os
21
Number of Programmable I/O
21
Number of PWM Channels
3
Number of SPI Channels
1
Number of Timers/Counters
3
Number of UART Channels
1
Oscillator Type
Internal
Peripherals
LVD, POR, PWM
RAM Size
384 B