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NXP Semiconductors MC9S12XDP512CAG
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.4 mm
Length
20 mm
Width
20 mm
Physical
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
144
Weight
1.319103 g
Technical
Core Architecture
HCS12
Data Bus Width
16 b
Density
4 Mb
Frequency
80 MHz
Interface
CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Max Frequency
40 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
5.5 V
Memory Size
512 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.35 V
Number of ADC Channels
24
Number of Bits
16
Number of I/Os
119
Number of Programmable I/O
119
Number of PWM Channels
8
Number of Timers/Counters
12
Operating Supply Voltage
5 V
Oscillator Type
External
Peripherals
I2C, LVD, POR, PWM, WDT
RAM Size
32 kB
Watchdog Timer
Yes