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NXP Semiconductors MC9S12NE64CPVE
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.6 mm
Physical
Case/Package
LQFP
Mount
2.375 V
Number of Pins
112
Weight
1.278308 g
Technical
Ambient Temperature Range High
105 °C
Core Architecture
HCS12
Data Bus Width
16 b
Density
512 kb
Frequency
25 MHz
Interface
EBI/EMI, Ethernet, I2C, SCI, SPI
Max Frequency
25 MHz
Max Junction Temperature (Tj)
125 °C
Max Operating Temperature
125 °C
Max Supply Voltage
125 °C
Memory Size
64 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of A/D Converters
1
Number of ADC Channels
8
Number of Bits
16
Number of Ethernet Channels
1
Number of I/Os
70
Number of I2C Channels
1
Number of Programmable I/O
70
Number of PWM Channels
4
Number of SPI Channels
1
Number of Timers/Counters
4
Operating Supply Voltage
2.5 V
Oscillator Type
Internal
Peripherals
I2C, POR, PWM, WDT
RAM Size
8 kB
Watchdog Timer
Yes