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NXP Semiconductors MC9S12E64CFUE
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Compliance
Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Physical
Case/Package
QFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
80
Weight
935.505914 mg
Technical
Access Time
25 µs
Core Architecture
HCS12
Data Bus Width
16 b
Density
512 kb
Frequency
25 MHz
Interface
EBI/EMI, I2C, SCI, SPI
Max Frequency
25 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
5.5 V
Memory Size
64 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.35 V
Number of Bits
16
Number of I/Os
60
Number of Programmable I/O
90
Number of PWM Channels
6
Number of Timers/Counters
12
Operating Supply Voltage
5 V
Oscillator Type
Internal
Peripherals
I2C, POR, PWM, WDT
RAM Size
4 kB
Watchdog Timer
Yes