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NXP Semiconductors MC9S12DG256CFUE
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
2.45 mm
Length
14 mm
Width
14 mm
Physical
Case/Package
QFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
80
Weight
935.505914 mg
Technical
Ambient Temperature Range High
85 °C
Core Architecture
HCS12
Data Bus Width
16 b
Density
2 Mb
Frequency
25 MHz
Interface
CAN, I2C, SCI, SPI
Max Frequency
25 MHz
Max Junction Temperature (Tj)
100 °C
Max Operating Temperature
85 °C
Max Supply Voltage
5.25 V
Memory Size
256 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.35 V
Number of A/D Converters
2
Number of ADC Channels
8
Number of Bits
16
Number of I/Os
59
Number of I2C Channels
1
Number of Programmable I/O
91
Number of PWM Channels
8
Number of SPI Channels
3
Number of Timers/Counters
13
Operating Supply Voltage
5 V
Oscillator Type
Internal
Peripherals
I2C, PWM, WDT
RAM Size
12 kB
Watchdog Timer
Yes