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NXP Semiconductors MC9S12DG128CPVE
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Compliance
Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.45 mm
Length
20 mm
Width
IBS
Physical
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
112
Weight
1.278308 g
Technical
Access Time
25 µs
Core Architecture
HCS12
Data Bus Width
16 b
Density
1 Mb
Frequency
25 MHz
Interface
CAN, I2C, SCI, SPI
Max Frequency
25 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
85 °C
Memory Size
128 kB
Memory Type
EEPROM, FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of I/Os
91
Number of I2C Channels
1
Number of Programmable I/O
91
Number of PWM Channels
8
Number of SPI Channels
2
Number of Timers/Counters
8
Operating Supply Voltage
5 V
Oscillator Type
Internal
Peripherals
I2C, PWM, WDT
RAM Size
8 kB
Termination
SMD/SMT
Watchdog Timer
Yes