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NXP Semiconductors MC9S12C32MFUE25
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Physical
Case/Package
QFP
Mount
Surface Mount
Number of Pins
80
Weight
935.505914 mg
Technical
Core Architecture
HCS12
Data Bus Width
16 b
Density
256 kb
Frequency
25 MHz
Interface
CAN, EBI/EMI, SCI, SPI
Max Frequency
16 MHz
Max Operating Temperature
125 °C
Max Supply Voltage
5.5 V
Memory Size
32 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.97 V
Number of Bits
16
Number of I/Os
60
Number of Programmable I/O
60
Number of PWM Channels
6
Number of Timers/Counters
1
Operating Supply Voltage
5 V
Oscillator Type
Internal
Peripherals
POR, PWM, WDT
RAM Size
2 kB
Watchdog Timer
Yes