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NXP Semiconductors MC9S08SH4CWJR
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Compliance
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
SOIC
Contact Plating
Tin
Mount
-40 °C
Number of Pins
20
Technical
Core Architecture
S08
Data Bus Width
8 b
Frequency
40 MHz
Interface
I2C, LIN, SCI, SPI
Max Operating Temperature
85 °C
Memory Size
85 °C
Memory Type
FLASH
Min Operating Temperature
-40 °C
Number of I/Os
17
Oscillator Type
Internal
Packaging
Tape & Reel (TR)
Peripherals
LVD, POR, PWM, WDT
RAM Size
256 B