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NXP Semiconductors MC9S08QG8CPBE
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Compliance
Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
3.43 mm
Length
19.55 mm
Width
6.85 mm
Physical
Case/Package
DIP
Mount
Through Hole
Number of Pins
16
Technical
Access Time
10 µs
Core Architecture
HCS08
Data Bus Width
8 b
Density
64 kb
Frequency
20 MHz
Interface
I2C, SCI, SPI
Max Frequency
20 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
85 °C
Memory Size
8 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of Bits
8
Number of I/Os
12
Number of I2C Channels
1
Number of Programmable I/O
12
Number of PWM Channels
2
Number of SPI Channels
1
Number of Timers/Counters
1
Number of UART Channels
1
Oscillator Type
Internal
Peripherals
I2C, LVD, POR, PWM, WDT
RAM Size
512 B
Watchdog Timer
Yes