NXP Semiconductors MC9S08QD4CSC
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Compliance
Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.5 mm
Length
5 mm
Width
4 mm
Physical
Case/Package
SOIC
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
8
Technical
Access Time
10 µs
Core Architecture
HCS08
Data Bus Width
8 b
Frequency
16 MHz
Interface
I2C, SCI, SPI
Max Frequency
8 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
5.5 V
Memory Size
4 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.7 V
Number of ADC Channels
4
Number of Bits
8
Number of I/Os
4
Number of Programmable I/O
4
Number of Timers/Counters
3
Oscillator Type
Internal
Peripherals
LVD, POR, PWM, WDT
RAM Size
256 B
Watchdog Timer
Yes