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NXP Semiconductors MC9S08PA4VWJ
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Compliance
Halogen Free
Halogen Free
Lead Free
Lead Free
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
2.5 mm
Length
12.8 mm
Width
7.5 mm
Physical
Case/Package
SOIC
Mount
Surface Mount
Number of Pins
20
Technical
Core Architecture
S08
Data Bus Width
8 b
Frequency
20 MHz
Interface
LIN, SCI, SPI, UART, USART
Max Frequency
20 MHz
Max Operating Temperature
105 °C
Max Supply Voltage
105 °C
Memory Size
4 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
12
Number of I/Os
18
Number of I2C Channels
1
Number of Programmable I/O
18
Number of SPI Channels
1
Number of Timers/Counters
2
Number of UART Channels
2
Oscillator Type
Internal
Packaging
Cut Tape
Peripherals
LVD, POR, PWM, WDT
RAM Size
512 B