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NXP Semiconductors MC9S08PA4AVDC

Tray, Bakeable, Multiple in Drypack, 8 Bit, Low End Core, 4K Flash, Tray Rohs Compliant: Yes

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Compliance

RoHS
Compliant

Dimensions

Height
900 µm

Technical

Core Architecture
S08
Data Bus Width
8 b
Frequency
20 MHz
Interface
900 µm
Max Operating Temperature
105 °C
Max Supply Voltage
105 °C
Memory Size
4 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of A/D Converters
1
Number of ADC Channels
4
Number of I/Os
6
Number of Timers/Counters
1
Number of UART Channels
1
RAM Size
512 B

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