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NXP Semiconductors MC9S08GB60ACFUE
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.4 mm
Length
10 mm
Width
10 mm
Physical
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
64
Technical
Core Architecture
HCS08
Data Bus Width
8 b
Density
480 kb
Frequency
40 MHz
Interface
I2C, SCI, SPI
Max Frequency
40 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
60 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
1.8 V
Number of ADC Channels
8
Number of Bits
8
Number of I/Os
56
Number of I2C Channels
1
Number of Programmable I/O
56
Number of PWM Channels
8
Number of SPI Channels
1
Number of Timers/Counters
8
Number of UART Channels
2
Operating Supply Voltage
3.3 V
Oscillator Type
Internal
Peripherals
I2C, LVD, POR, PWM, WDT
RAM Size
4 kB
Termination
SMD/SMT
Watchdog Timer
Yes