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NXP Semiconductors MC9S08DZ60AMLC
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Compliance
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Physical
Case/Package
LQFP
Contact Plating
Tin
Number of Pins
32
Technical
Core Architecture
S08
Data Bus Width
8 b
Frequency
40 MHz
Interface
CAN, I2C, LIN, SCI, SPI
Max Operating Temperature
125 °C
Max Supply Voltage
125 °C
Memory Size
60 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of I/Os
26
Number of Programmable I/O
53
Number of PWM Channels
8
Number of Timers/Counters
2
Oscillator Type
External
Peripherals
I2C, LVD, POR, PWM, WDT
RAM Size
4 kB