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NXP Semiconductors MC9S08DZ16AMLC
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Compliance
Halogen Free
Halogen Free
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
LQFP
Number of Pins
32
Technical
Core Architecture
HC08
Data Bus Width
8 b
Frequency
40 MHz
Interface
CAN, I2C, SCI, SPI
Max Operating Temperature
125 °C
Max Supply Voltage
125 °C
Memory Size
16 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of I/Os
12
Number of Programmable I/O
26
Number of Timers/Counters
2
Oscillator Type
Internal
Peripherals
LVD, POR, PWM
RAM Size
1 kB