NXP Semiconductors MC9S08AW32CFGE
产品详情
Find similar products
Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1.4 mm
Length
10 mm
Width
8542310000, 8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|8542310000|85
Physical
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
44
Technical
Core Architecture
HCS08
Data Bus Width
8 b
Density
256 kb
Frequency
40 MHz
Interface
I2C, SCI, SPI
Max Frequency
40 MHz
Max Operating Temperature
85 °C
Max Supply Voltage
85 °C
Memory Size
32 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of Bits
8
Number of I/Os
34
Number of I2C Channels
1
Number of Programmable I/O
34
Number of PWM Channels
8
Number of SPI Channels
1
Number of Timers/Counters
8
Number of UART Channels
2
Oscillator Type
Internal
Peripherals
I2C, LVD, POR, PWM, WDT
RAM Size
2 kB
Watchdog Timer
Yes