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NXP Semiconductors MC68HC908GP32CP
产品详情
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Compliance
Halogen Free
Not Halogen Free
Lead Free
Contains Lead
RoHS
Compliant
Physical
Case/Package
DIP
Number of Pins
40
Technical
Access Time
8 µs
Address Bus Width
8 b
Core Architecture
HC08
Density
256 kb
Frequency
8 MHz
Interface
SCI, SPI
Max Frequency
8 MHz
Max Operating Temperature
85 °C
Memory Size
85 °C
Memory Type
FLASH
Min Operating Temperature
-40 °C
Number of ADC Channels
-40 °C
Number of I/Os
33
Number of Timers/Counters
2
Oscillator Type
Internal
Packaging
Bulk
Peripherals
LVD, POR, PWM
RAM Size
512 B