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NXP Semiconductors LPC822M101JHI33Y
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Compliance
RoHS
Compliant
Dimensions
Height
850 µm
Physical
Number of Pins
32
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
30 MHz
Interface
850 µm
Max Frequency
30 MHz
Max Junction Temperature (Tj)
150 °C
Max Operating Temperature
150 °C
Max Power Dissipation
105 °C
Max Supply Voltage
3.6 V
Memory Size
16 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
12
Number of I/Os
29
Number of I2C Channels
4
Number of Programmable I/O
29
Number of PWM Channels
6
Number of SPI Channels
2
Number of Timers/Counters
3
Number of UART Channels
7
Operating Supply Voltage
3.3 V
Oscillator Type
Internal
Packaging
Tape & Reel (TR)
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
RAM Size
4 kB
Watchdog Timer
Yes