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NXP Semiconductors LPC55S69JBD100K
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Dimensions
Height
1.6 mm
Technical
Core Architecture
ARM Cortex-M33
Data Bus Width
32 b
Frequency
150 MHz
Interface
I2C, I2S, SPI, UART, USART, USB
Max Junction Temperature (Tj)
107 °C
Max Operating Temperature
107 °C
Max Supply Voltage
105 °C
Memory Size
640 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of A/D Converters
1
Number of ADC Channels
10
Number of I/Os
64
Number of I2C Channels
8
Number of PWM Channels
8
Number of SPI Channels
8
Number of Timers/Counters
11
Number of UART Channels
8
Number of USB Channels
2
RAM Size
320 kB