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NXP Semiconductors LPC2925FBD100,551
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Dimensions
Height
1.45 mm
Length
14.1 mm
Width
14.1 mm
Physical
Case/Package
LQFP
Mount
Surface Mount
Number of Pins
100
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
125 MHz
Interface
CAN, I2C, LIN, SPI, UART, USART, USB
Max Frequency
80 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
85 °C
Max Supply Voltage
3.6 V
Memory Size
512 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of I/Os
60
Number of I2C Channels
2
Number of Programmable I/O
76
Number of PWM Channels
6
Number of SPI Channels
3
Number of Timers/Counters
6
Number of UART Channels
2
Operating Supply Voltage
3.3 V
Oscillator Type
Internal
Peripherals
DMA, POR, PWM, WDT
RAM Size
40 kB