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NXP Semiconductors LPC1830FET100,551
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
800 µm
Length
9.4 mm
Width
9.1 mm
Physical
Case/Package
TFBGA
Mount
Surface Mount
Number of Pins
100
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
180 MHz
Interface
800 µm
Max Frequency
150 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
85 °C
Max Supply Voltage
3.6 V
Memory Size
128 B
Memory Type
ROMless, SRAM
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of Ethernet Channels
1
Number of I/Os
49
Number of I2C Channels
2
Number of Programmable I/O
49
Number of SPI Channels
4
Number of Timers/Counters
6
Number of UART Channels
4
Oscillator Type
Internal
Peripherals
Brown-out Detect/Reset, DMA, I2C, POR, WDT
RAM Size
200 kB
Watchdog Timer
Yes