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NXP Semiconductors LPC1313FHN33/01
产品详情
Compliance
RoHS
Non-Compliant
Dimensions
Height
950 µm
Length
7.1 mm
Width
7.1 mm
Physical
Case/Package
SOT-865-3
Number of Pins
33
Technical
Core Architecture
ARM
Data Bus Width
32 b
Max Frequency
72 MHz
Max Operating Temperature
85 °C
Memory Size
32 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Number of ADC Channels
8
Number of GPIO
28
Number of I2C Channels
1
Number of SPI Channels
1
Number of Timers/Counters
4
Number of UART Channels
1
Operating Supply Voltage
3.3 V
RAM Size
8 kB