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NXP Semiconductors LPC11U35FHI33/501,
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
850 µm
Length
5.1 mm
Width
5.1 mm
Physical
Case/Package
QFN
Mount
Surface Mount
Number of Pins
33
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
50 MHz
Interface
I2C, SPI, SSP, UART, USART, USB
Max Frequency
50 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
1.5 W
Max Supply Voltage
3.6 V
Memory Size
64 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
1.8 V
Min Supply Voltage (DC)
1.8 V
Number of ADC Channels
8
Number of I/Os
26
Number of I2C Channels
1
Number of Programmable I/O
26
Number of SPI Channels
2
Number of Timers/Counters
4
Number of USB Channels
1
Operating Supply Voltage
3.3 V
RAM Size
12 kB
Watchdog Timer
Yes