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NXP Semiconductors LPC1114FHN33/201,5
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Dimensions
Height
950 µm
Length
7.1 mm
Width
7.1 mm
Physical
Mount
Surface Mount
Number of Pins
33
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
50 MHz
Interface
950 µm
Max Frequency
50 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
85 °C
Max Supply Voltage
3.6 V
Memory Size
32 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of I/Os
28
Number of I2C Channels
1
Number of Programmable I/O
28
Number of SPI Channels
1
Number of Timers/Counters
4
Number of UART Channels
1
Operating Supply Voltage
3.3 V
RAM Size
4 kB
Watchdog Timer
Yes