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NXP Semiconductors LPC1113FHN33/302,5
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
1 mm
Length
7.1 mm
Width
7.1 mm
Physical
Mount
Surface Mount
Number of Pins
33
Technical
Core Architecture
ARM
Data Bus Width
32 b
Frequency
50 MHz
Interface
I2C, SPI, SSP, UART, USART
Max Frequency
50 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
85 °C
Max Supply Voltage
3.6 V
Memory Size
24 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of Bits
32
Number of I/Os
42
Number of I2C Channels
1
Number of Programmable I/O
28
Number of PWM Channels
13
Number of SPI Channels
1
Number of Timers/Counters
4
Number of UART Channels
1
Operating Supply Voltage
3.3 V
RAM Size
8 kB
Watchdog Timer
Yes