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NXP Semiconductors BBY40,235
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Compliance
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
TO-236-3
Contact Plating
Tin
Mount
-55 °C
Number of Pins
3
Technical
Capacitance
32 pF
Element Configuration
Single
Forward Current
20 mA
Max Operating Temperature
125 °C
Min Operating Temperature
125 °C
Packaging
Tape and Reel
Reverse Voltage (DC)
30 V
Termination
SMD/SMT