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NXP Semiconductors BAP70-02,115
产品详情
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Compliance
Lead Free
650 µm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Height
650 µm
Length
1.25 mm
Width
850 µm
Physical
Case/Package
SOD
Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Technical
Diode Type
PIN - Single
Element Configuration
Single
Forward Current
100 mA
Forward Voltage
1.1 V
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Max Repetitive Reverse Voltage (Vrrm)
50 V
Max Reverse Voltage (DC)
50 V
Min Operating Temperature
-65 °C
Packaging
Cut Tape
Power Dissipation
415 mW
Reverse Voltage
50 V
Reverse Voltage (DC)
50 V
Termination
SMD/SMT
Test Current
100 mA