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NXP Semiconductors BAP64Q,125
产品详情
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Compliance
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
TSOP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
5
Technical
Forward Current
100 mA
Forward Voltage
950 mV
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
125 mW
Min Operating Temperature
-65 °C
Packaging
Tape and Reel
Power Dissipation
125 mW
Reverse Voltage
100 V
Reverse Voltage (DC)
100 V