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NXP Semiconductors BAP50-03,135
产品详情
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Compliance
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
SOD-323-2
Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Technical
Diode Type
PIN - Single
Element Configuration
Single
Forward Current
50 mA
Forward Voltage
1.1 V
Max Current Rating
50 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Min Operating Temperature
-65 °C
Packaging
Tape and Reel
Power Dissipation
500 mW
Reverse Voltage
50 V
Reverse Voltage (DC)
50 V