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Micron MT29F16G08CBACAWP:C
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Compliance
Radiation Hardening
No
RoHS
Compliant
Physical
Case/Package
TSOP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
48
Supply Chain
Lifecycle Status
Production
Technical
Density
16 Gb
Interface
Parallel
Max Operating Temperature
70 °C
Memory Size
1.9 GB
Memory Type
FLASH, MLC NAND, NAND
Min Operating Temperature
0 °C
Nominal Supply Voltage (DC)
3.3 V
Operating Supply Voltage
3.3 V
Sync/Async
Asynchronous
Word Size
8 b