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Microchip DSPIC33CK256MP508T-I/PT

MCU 16-Bit dsPIC DSC Modified Harvard Architecture 256KB Flash 3V to 3.6V 80-Pin TQFP T/R

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Compliance

RoHS
Non-Compliant

Dimensions

Height
1.2 mm

Physical

Case/Package
TQFP

Supply Chain

Lifecycle Status
Production

Technical

Ambient Temperature Range High
85 °C
Core Architecture
dsPIC
Data Bus Width
16 b
Frequency
100 MHz
Interface
CAN, I2C, IrDA, LIN, SPI, UART
Max Junction Temperature (Tj)
125 °C
Max Operating Temperature
85 °C
Max Supply Voltage
3.6 V
Memory Size
256 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
3 V
Number of A/D Converters
3
Number of ADC Channels
24
Number of I/Os
69
Number of I2C Channels
3
Number of PWM Channels
8
Number of SPI Channels
3
Number of Timers/Counters
1
Number of UART Channels
3
RAM Size
24 kB

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