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EPCOS B82498F3829K000

Ind Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 0805 Blister T/R

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Compliance

RoHS
Non-Compliant

Dimensions

Depth
90 mΩ
Length
2.3 mm
Max Length
2.3 mm
Max Width
1.7 mm

Physical

Case/Package
0805
Core Material
Ceramic

Supply Chain

Lifecycle Status
Production

Technical

Current Rating
700 mA
DC Current
700 mA
DC Resistance (DCR)
90 mΩ
Inductance
8.2 nH
Military Standard
Not
Packaging
Tape and Reel
Q Factor
50
Self Resonant Frequency
5 GHz
Test Frequency
250 MHz
Tolerance
10 %

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