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EPCOS B82498F3821J000

Ind Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 0805 Blister T/R

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Compliance

RoHS
Non-Compliant

Dimensions

Depth
1.9 Ω
Length
2.3 mm
Max Length
2.3 mm
Max Width
1.7 mm

Physical

Case/Package
0805
Core Material
Ceramic

Supply Chain

Lifecycle Status
Production

Technical

Current Rating
180 mA
DC Current
180 mA
DC Resistance (DCR)
1.9 Ω
Inductance
820 nH
Military Standard
Not
Packaging
Tape and Reel
Q Factor
23
Self Resonant Frequency
300 MHz
Test Frequency
25 MHz
Tolerance
5 %

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