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EPCOS B82498F3561G000

Ind Chip Molded Wirewound 560nH 2% 25MHz 23Q-Factor Ceramic 230mA 0805 Blister T/R

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Compliance

RoHS
Compliant

Dimensions

Depth
1.7 mm
Length
2.3 mm
Max Length
2.3 mm
Max Width
1.7 mm

Physical

Case/Package
0805
Core Material
Ceramic
Weight
5.499807 mg

Supply Chain

Lifecycle Status
Production

Technical

Current Rating
230 mA
DC Current
230 mA
DC Resistance (DCR)
95 Ω
Inductance
560 nH
Max Operating Temperature
150 °C
Military Standard
Not
Min Operating Temperature
-55 °C
Packaging
Tape and Reel
Self Resonant Frequency
400 MHz
Termination
SMD/SMT
Test Frequency
25 MHz
Tolerance
2 %

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