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EPCOS B82498F3560J

Ind Chip Molded Wirewound 56nH 5% 200MHz 60Q-Factor Ceramic 600mA 0805 Blister T/R

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Compliance

Lead Free
5 %
Radiation Hardening
No
Ratings
AEC-Q200
RoHS
Compliant

Dimensions

Depth
140 mΩ
Height
1.4 mm
Height - Seated (Max)
1.397 mm
Length
2.3 mm
Width
1.7018 mm

Physical

Case Code (Imperial)
0805
Case Code (Metric)
2012
Case/Package
0805
Core Material
Ceramic
Mount
-55 °C
Number of Pins
2
Weight
IBS

Technical

Composition
Wirewound
Current Rating
600 mA
DC Current
600 mA
DC Resistance (DCR)
140 mΩ
Inductance
56 nH
Inductance Tolerance
5%
Max DC Current
600 mA
Max Operating Temperature
150 °C
Military Standard
150 °C
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
387856
Self Resonant Frequency
1.7 GHz
Shielding
Unshielded
Termination
SMD/SMT
Test Frequency
200 MHz
Tolerance
5 %

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