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EPCOS B82422A3220K100

Ind Chip Molded Wirewound 22nH 10% 10MHz 30Q-Factor Ceramic 600mA 1210 Blister T/R

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Compliance

Lead Free
Lead Free
Radiation Hardening
No
Ratings
AEC-Q200
RoHS
Compliant

Dimensions

Depth
2.8 mm
Height
2 mm
Height - Seated (Max)
2.1082 mm
Length
3.2 mm
Max Length
3.5 mm
Max Width
2.8 mm
Width
2.5 mm

Physical

Case Code (Imperial)
1210
Case Code (Metric)
3225
Case/Package
1210
Core Material
Ceramic
Mount
Surface Mount
Number of Pins
2
Weight
50.008559 mg

Supply Chain

Lifecycle Status
Production

Technical

Composition
Wirewound
Current Rating
600 mA
DC Current
600 mA
DC Resistance (DCR)
140 mΩ
Inductance
22 nH
Inductance Tolerance
10 %
Max DC Current
600 mA
Max Operating Temperature
125 °C
Military Standard
Not
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
30
Resistance
140 mΩ
Self Resonant Frequency
2.5 GHz
Shielding
Unshielded
Termination
SMD/SMT
Test Frequency
10 MHz
Tolerance
10 %

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